Semiconductor device, control method thereof and data processing system

ABSTRACT

Disclosed herein is a semiconductor device comprising a global bit line, a first local bit line coupled to normal memory cells, a second local bit line coupled to redundant memory cells first and second hierarchical switches, a precharge circuit precharging the global bit line, a redundancy determination circuit determining whether or not an accessed address matches a defective address, and a control circuit. In a standby state, the global bit line and the second local bit line are precharged through the second hierarchical switch. In an active state, the first local bit line is precharged through the first hierarchical switch, subsequently when the redundancy determination circuit determines that the addresses do not match, the second hierarchical switch is inactivated to access the normal memory cells, and when the redundancy determination circuit determines that the addresses match each other, the first hierarchical switch is inactivated to access the redundant memory cells.

This application is a Continuation of application Ser. No. 14/147,692,filed Jan. 6, 2014, which is Continuation of application Ser. No.13/431,654, filed Mar. 28, 2012, which is based on Japanese PatentApplication No. 2011-071052 filed on Mar. 28, 2011, the disclosures ofwhich are incorporated herein by reference in their entirety.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a semiconductor device comprising amemory cell array having a hierarchical bit line structure in whichthere are redundant memory cells for replacing normal memory cells thatare defective, and relates to a control method thereof and a dataprocessing system comprising the semiconductor device.

2. Description of Related Art

In semiconductor memory devices of recent years such as a DRAM, anincrease in capacity and a reduction in size have been achieved, whichcauses the number of memory cells on a bit line to increase. In order todeal with this performance problem, hierarchical bit lines includingglobal bit lines and local bit lines tend to be employed. In general,the hierarchical bit lines are provided with hierarchical switchescontrolling connections between the global bit lines and the local bitlines. In this kind of the hierarchical bit lines, when sense amplifiersare connected to one ends of the global bit lines, it is necessary topreviously precharge the global bit lines and the local bit lines to acommon potential prior to accessing memory cells. In this case, if aprecharge circuit is provided for each of a large number of local bitlines for one global bit line, a circuit scale thereof increases.Therefore, by appropriately controlling the hierarchical switches, aprecharge circuit for the global bit line is desired to be commonly usedin a precharge operation of the local bit lines. For example, PatentReference 1 discloses a control method of the hierarchical switches thatenable precharging the local bit lines using the precharge circuit forthe global bit line in a memory cell array having the hierarchical bitlines.

-   [Patent Reference 1] Japanese Patent Application Laid-open No.    2007-287209 (U.S. Pat. No. 7,460,388)

A semiconductor device of large capacity such as a DRAM is generallyprovided with redundant memory cells for replacing normal memory cellsfor the purpose of repairing defective memory cells. If a redundantregion including the normal memory cells and the redundant memory cellsis formed in the above memory cell array having the hierarchical bitlines, there is provided a redundancy determination circuit fordetermining whether or not an address of an access target is a defectiveaddress when accessing a memory cell. Therefore, an operation procedureis necessary in which a hierarchical switch corresponding to theprecharge operation of the hierarchical bit lines to be accessed iscontrolled after waiting for a determination result of the redundancydetermination circuit when accessing a normal memory cell. Since ittakes a relatively long time to obtain the determination result of theredundancy determination circuit, there is a risk that driving timing ofa word line or a redundant word line may be delayed after the prechargeoperation of the hierarchical bit lines is completed, thereby decreasingaccess speed. Meanwhile, all hierarchical bit lines (a plurality oflocal bit lines corresponding to one global bit line) can be previouslyprecharged in a standby state in order to shorten the time required tocontrol the hierarchical switches. However, this control is not desiredsince an increase in consumption current of the semiconductor device isinevitable. Further, bringing a plurality of hierarchical switchescorresponding to the plurality of local bit lines that are not to beaccessed into a non-selected state is not desired in a viewpoint of theconsumption current. In this manner, when the redundant region is formedin the memory cell array having the conventional hierarchical bit lines,there is a problem that it is difficult to keep a high access speed whenaccessing the memory cells without increasing the consumption current.

SUMMARY

A semiconductor device according to an embodiment of the disclosurecomprises: a global bit line; a first local bit line to which normalmemory cells are connected, the first local bit line corresponding tothe global bit line; a first hierarchical switch controlling anelectrical connection between the global bit line and the first localbit line; a second local bit line to which redundant memory cellsreplacing at least the normal memory cells are connected, the secondlocal bit line corresponding to the global bit line; a secondhierarchical switch controlling an electrical connection between theglobal bit line and the second local bit line; a precharge circuitprecharging the global bit line to a predetermined voltage; a prechargecircuit precharging the global bit line to a predetermined voltage; aredundancy determination circuit determining whether or not an addressspecifying a memory cell to be accessed matches a defective address; anda control circuit controlling operations of the normal memory cells, theredundant memory cells, the precharge circuit and the redundancydetermination circuit. In the semiconductor device, the control circuitperforms an operation in a standby state, in which the precharge circuitand the second hierarchical switch are activated so that the global bitline and the second local bit line are precharged to the predeterminedvoltage, and the first hierarchical switch is inactivated so that thefirst local bit line is brought into a floating state, and the controlcircuit performs an active operation to access the normal memory cells,in which the first hierarchical switch is activated before receiving adetermination result of the redundancy determination circuit so that thefirst local bit line is precharged to the predetermined voltage,subsequently when the determination result indicates that the addressesdo not match each other, the first hierarchical switch is maintainedactive while the second hierarchical switch that has been active isinactivated and the precharge circuit is inactivated so as to access thenormal memory cells, and when the determination result indicates thatthe addresses match each other, the first hierarchical switch hat hasbeen active is inactivated and the precharge circuit is inactivated soas to access the redundant memory cells.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a diagram showing an embodiment of the invention;

FIG. 2 is a block diagram schematically showing a configuration of aDRAM of an embodiment;

FIG. 3 is a diagram showing a partial configuration of an array regionin the DRAM of the embodiment;

FIG. 4 is a diagram showing a circuit configuration example of a senseamplifier in a sense amplifier array of FIG. 3;

FIG. 5 is a diagram showing operation waveforms when a normal sub-matSM(0) of a memory mat M of FIG. 3 is selected as an access target and aredundancy determination signal indicates a mishit state;

FIG. 6 is a diagram showing operation waveforms when a normal sub-matSM(0) of the memory mat M of FIG. 3 is selected as the access target andthe redundancy determination signal indicates a hit state;

FIG. 7 is a diagram showing operation waveforms when a redundant sub-matSM(m) of the memory mat M of FIG. 3 is selected as the access target;and

FIG. 8 is a diagram showing a configuration example of a data processingsystem comprising a semiconductor device having the configurationdescribed in the embodiments and a controller controlling operations ofthe semiconductor device.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

It is apparent that the present invention is not limited to embodimentsdescribed below, but should be construed based on the disclosure of theclaims.

As shown in FIG. 1, an embodiment of the invention is a semiconductordevice comprising a memory cell array having hierarchical bit lines.FIG. 1 shows a range including one global bit line GBL and correspondingtwo local bit lines LBL that form a hierarchical bit line structure. Amemory region M1 as the normal region includes a normal memory cell MC(hereinafter, referred to simply as “memory cell MC”) selected by a wordline WL, hierarchical bit lines including the global bit line GBL and alocal bit line LBL1, and a hierarchical switch SW1 controlling anelectrical connection between the global bit line GBL and the local bitline LBL1. A memory region M2 including the redundant region includes aredundant memory cell RC selected by a redundant word line WLR,hierarchical bit lines including the global bit lines GBL and a localbit line LBL2, and a hierarchical switch SW2 controlling an electricalconnection between the global bit line GBL and the local bit line LBL2.A precharge circuit PCC is a circuit that precharges the global bitlines GBL to a voltage VBLP.

Meanwhile, a redundancy determination circuit RDC determines whether ornot a row address RADT as an access target matches a previously storeddefective address Rd. A control circuit CC controls operations of thememory regions M1, M2, the precharge circuit PCC, and the redundancydetermination circuit RDC. In a standby state, the global bit line GBLis previously precharged to the voltage VBLP by the precharge circuitPCC under the control of the control circuit CC, and the hierarchicalswitch SW2 is turned on in this state so that the local bit line LBL2 isalso precharged to the voltage VBLP. On the other hand, the hierarchicalswitch SW1 is OFF, and the local bit line LBL1 in the memory region M1is brought into a floating state. Since the voltage of the redundantword line WL allows disconnecting the redundant memory cell RC from thelocal bit line LBL2, destruction of data of the redundant memory cell RCdoes not occur.

Subsequently, when accessing the memory region M1, the hierarchicalswitch SW1 is turned on so that the local bit line LBL1 is immediatelyprecharged to the voltage VBLP. The redundancy determination circuit RDCdetermines whether or not the row address RADT to be accessed matchesthe defective address Rd and outputs its determination result after apredetermined time elapses in parallel with precharging the local bitline LBL1. Then, if the determination result shows that they match eachother (accessing the redundant memory cell RC instead of the normalmemory cell MC), the hierarchical switch SW1 is changed from ON to OFFagain so that the redundant memory cell RC is accessed (at least theredundant word line WLR is activated) through the other hierarchicalswitch SW2 in an ON state. On the other hand, if the determinationresult shows that they do not match (accessing the normal memory cellMC), the hierarchical switch SW1 is kept ON so that the redundant memorycell RC is accessed through the other hierarchical switch SW2 in the ONstate. In this manner, when transitioning from the standby state to anactive operation, the precharge operation of the local bit line LBL1 tobe accessed can be rapidly performed without waiting for thedetermination result of the redundancy determination circuit RDC.Therefore, it is possible to reliably prevent a decrease in accessspeed, and precharge circuits for the local bit lines LBL1 and LBL2 arenot necessarily provided, thereby reducing a circuit scale. AlthoughFIG. 1 shows the example in which the memory region M2 includes theredundant memory cell RC, the memory region M2 may include a normalmemory cell MC in addition to the redundant memory cell RC.

Further, if a memory cell array is formed by a plurality of memoryregions M1 and the memory region M2 including the redundant region,which is not shown in FIG. 1, the hierarchical switch SW1 in one memoryregion M1 to be accessed is controlled in the above-described manner,and hierarchical switches SW1 in remaining memory regions M1 not to beaccessed are controlled to remain in the standby state. That is, thehierarchical switches SW1 in the remaining memory regions M1 not to beaccessed are kept OFF in both the standby state and the activeoperation. Thus, a plurality of local bit lines LBL1 in the remainingmemory regions M1 not to be accessed are not precharged. Accordingly,the consumption current does not occur due to the hierarchical switchesSW1 and the local bit lines LBL1 in the remaining memory regions M1 notto be accessed.

Further, if the memory region M2 includes a normal memory cell MC to beaccessed, the plurality of hierarchical switch SW1 in memory regions M1not to be accessed are not switched and corresponding local bit linesLBL1 are not precharged, and thereby corresponding consumption currentdoes not occur.

Further embodiments will be described in detail below with reference toaccompanying drawings. In the following embodiments, the presentinvention is applied to a DRAM (Dynamic Random Access Memory) having thehierarchical bit lines as an example of the semiconductor device.

FIGS. 2 and 3 are a block diagram schematically showing a configurationof the DRAM of an embodiment and a detailed diagram of its part. TheDRAM shown in FIG. 2 includes hierarchical bit lines (global bit linesGBL and local bit lines LBL of FIG. 3) and hierarchical word lines (mainword lines MWL (not shown) and sub-word lines SWL of FIG. 3), and thereis provided an array region 10 (FIG. 2) including a large number ofmemory cells MC (FIG. 3) arranged at intersections of the local bitlines LBL and the sub-word lines SWL. The main word lines MWL does notdirectly contribute to the invention and thus they are omitted. Thearray region 10 includes a plurality of memory mats M, M(L) and M(R)(FIG. 3) each as a unit area, and the unit area includes a normal region(the memory region M1 of FIG. 1) and a redundant region (the memoryregion M2 of FIG. 1) for repairing, which will be described in detaillater. Further, the array region 10 includes circuits associated withthe memory cells MC. For example, there are provided the circuitsincluding hierarchical switches SW (FIG. 3) corresponding to thehierarchical bit lines, sense amplifiers SA (FIG. 3) each connected toone end of each global bit line GBL, and other circuits not shown in thefigures. The hierarchical switches SW correspond to the hierarchicalswitches SW1 and SW2 in FIG. 1.

FIG. 2 shows a row address latch 11, a redundancy determination circuit12, a row decoder 13, and a control circuit 20 in addition to the arrayregion 10. Here, FIG. 2 mainly shows row circuits in a configuration ofthe DRAM, and column circuits from the sense amplifiers SA to externaldata terminals (not shown) and other circuits are omitted. The rowaddress latch 11 receives an address signal ADD supplied from outside,for example, and outputs the row address RADT under control of a rowcontrol unit 25 included in the control circuit 20. The row address RADTis sent to the redundancy determination circuit 12, the row decoder 13,and a hierarchical switch control unit 24 in the control circuit 20. Therow control unit 25 also controls a word driver 21, a sense amplifiercontrol unit 22, a memory mat control unit 23, and the hierarchicalswitch control unit 24.

The redundancy determination circuit 12 determines whether or not acorresponding normal memory cell MC in the normal region should bereplaced with a redundant memory cell RC in the redundant region basedon the received row address RADT. In the redundancy determinationcircuit 12, information of defective addresses for specifying defectivecells that need to be repaired is previously stored, for example, infuse elements (not shown) or the like. The redundancy determinationcircuit 12 compares the row address RADT with the stored defectiveaddresses, and outputs a redundancy determination signal RDS indicatinga comparison result to the row decoder 13, the memory mat control unit23 and the hierarchical switch control unit 24. The redundancydetermination signal RDS indicates a hit state (for example, a highlevel) when the row address RADT matches the defective address, andindicates a mishit state (for example, a low level) when the row addressRADT does not match the defective addresses.

The row decoder 13 receives the row address RADT and the redundancydetermination signal RDS, and selects a word line WL (sub-word line SWL)included in the normal region to be accessed or the redundant region viathe word driver 21 in the array region 10. Here, a sub-word line SWL isselected via amain word line MWL. When the redundancy determinationsignal RDS indicates the mishit state, the normal region in the arrayregion 10 is selected as an access target, and when the redundancydetermination signal RDS indicates the hit state, the redundant regionin the array region 10 is selected to be used for repairing. The rowdecoder 13 further sends control signals to the word driver 21, thesense amplifier control unit 22, the memory mat control unit 23 and thehierarchical switch control unit 24 respectively that are included inthe control circuit 20. That is, the memory mats M, M(L) and M(R) andsub-mats SM(0) to SM(m) therein are respectively selected by the rowdecoder 13 in accordance with the row address RADT and the redundancydetermination signal RDS. This is because that the word driver 21, thesense amplifier control unit 22 and the memory mat control unit 23 arerespectively controlled as a unit including each of the sub-mats SM(0)to SM(m). The word driver 21 controls the hierarchical word linescorresponding to the memory mats M in the array region 10, the senseamplifier control unit 22 controls potentials of sense amplifier drivinglines SAP and SAN supplied to the respective sense amplifiers SAcorresponding to the memory mats M, and the memory mat control unit 23controls a later-described bit line equalizing signal BLEQ correspondingto the memory mats M in the array region 10.

Meanwhile, the hierarchical switch control unit 24 included in thecontrol circuit 20 sends switch control signals SWC for controllingconnection states of the hierarchical switches SW corresponding to thememory mats M and the sub-mats SM in the array region 10 based on therow address RADT from the row address latch 11 and the redundancydetermination signal RDS from the redundancy determination circuit 12.The control of the control signals SWC by the hierarchical switchcontrol unit 24 varies depending on whether or not the redundant regionis included in a control target, which will be described in detaillater.

Next, FIG. 3 is a diagram showing a partial configuration of the arrayregion 10 in the DRAM of the embodiment. FIG. 3 shows a plurality ofmemory mats M as a partial region of the array region 10 of FIG. 2 andsense amplifier arrays SAA arranged on both sides of each memory mat M.Each memory mat M is partitioned into m+1 sub-mats SM aligned in anextending direction of the global bit lines GBL. Hereinafter, each ofthe sub-mats SM of the memory mats M is represented with an appropriatenumber, and FIG. 3 shows sub-mats SM(0) to SM(m) from the left end.Among these, there are m sub-mats SM(0) to SM (m−1), which may bereferred to as “normal sub-mats SM(0) to SM(m−1)” hereinafter, includingonly a plurality of normal memory cells MC as the normal region, and onesub-mat SM(m), which may be referred to as “redundant sub-mat SM(m)”hereinafter, including both the normal region and a plurality ofredundant memory cells RC as the redundant region. Here, the normalmemory cells MC and the redundant memory cells RC are memory cells forrow circuits associated with the global bit lines GBL and the local bitlines LBL, each of which is assigned a corresponding external address.FIG. 3 does not show redundant memory cells for column circuitsassociated with a so-called column redundancy including redundant globalbit lines and redundant local bit lines. In other words, each of thesub-mats SM(0) to SM(m) may include the redundant memory cells for thecolumn circuits, and corresponding redundant global bit lines, redundantlocal bit lines and redundant sense amplifiers. This is because that thecolumn redundancy is not directly related to effects of the embodiments.That is, the effects of the embodiments are characterized by the normalsub-mats SM(0) to SM(m−1) and the redundant sub-mat SM(m) that specifywhether or not the redundant memory cell for the row circuits exist,since features thereof include the control of the hierarchical switchesSW and the like and the control circuit performing the control.

In addition, the normal sub-mats SM(0) to SM(m−1) correspond to a firstmemory region, and the redundant sub-mat SM(m) corresponds to a secondmemory region. Although, in the example of FIG. 3, there is provided theredundant sub-mat SM(m) at one end in the memory mat M, an arbitrarysub-mat SM in the memory mat M can be used as the redundant sub-mat.

As described above, the bit line structure of the memory mat M ishierarchized into the global bit lines GBL and the local bit lines LBL.Each of the global bit lines GBL extends over the m+1 sub-mats SM in thememory mat M. The global bit lines GBL are alternately connected to thesense amplifiers SA included in the sense amplifier arrays SAA on bothsides in their arrangement order (zigzag arrangement). In addition, thememory mat M shown in FIG. 3 has an open bit line structure. The memorymat M(L) is arranged on the left of the memory mat M via one senseamplifier array SAA, and the memory mat M(R) is arranged on the right ofthe memory mat M via the other sense amplifier array SAA. Each senseamplifier SA has a differential configuration that amplifies a signalvoltage transmitted through the global bit line GBL. A specificconfiguration of the sense amplifier SA will be described later.Although the global bit lines GBL on both sides of the sense amplifierarray SAA have the same symbol (GBL), the embodiment employs the openbit line structure and therefore one of the global bit lines GBLelectrically corresponds to so-called “true” (a later-described globalbit line GBL (L) in FIG. 4) and the other thereof corresponds toso-called “bar” (a later-described global bit line GBL (R) in FIG. 4).

In each sub-mat SM, the local bit lines LBL whose number is the same asthe global bit lines GBL are arranged. That is, m+1 local bit lines LBLaligned on the same straight line correspond to each one of the globalbit lines GBL. Thus, when L global bit lines GBL are arranged in theentire memory mat M, L×(m+1) local bit lines LBL are arranged therein.Thereby, the length of each local bit line LBL is shortened to 1/(n+1)of the length of each global bit line GBL.

Further, the word line structure of the memory mat M is hierarchizedinto main word lines MWL and sub-word lines SWL. However, FIG. 3 showsonly the sub-word lines SWL, and the main word lines MWL are omitted. Apredetermined number of sub-word lines SWL are arranged in each of thenormal sub-mats SM(0) to SM(m−1). Meanwhile, two redundant sub-wordlines SWLR are arranged in the redundant sub-mat SM(m), in addition tothe predetermined number of sub-word lines SWL. A plurality of memorycells MC (the normal memory cells) are arranged at intersections of thelocal bit lines LBL and the sub-word lines SWL in all the sub-mats SM.Meanwhile, a plurality of redundant memory cells RC are arranged atintersections of the local bit lines LBL and the two redundant sub-wordlines SWLR in the redundant region of the redundant sub-mat SM(m). Eachof the normal memory cells MC and the redundant memory cells RC iscomposed of a selection transistor QO selectively switched by acorresponding sub-word line SWL or a corresponding redundant sub-wordline SWLR, and a capacitor CS storing data as electric charge of a datastorage node.

Further, in each sub-mat SM, there is provided a plurality ofhierarchical switches SW arranged at one ends of the local bit linesLBL. Each hierarchical switch SW is an NMOS-type transistor(field-effect transistor) controlling an electrical connection betweenthe global bit line GBL and the local bit line LBL in response to eitherpotential of two lines for the switch control signal SWC applied throughone of the two lines to its gate. In the memory mat M of FIG. 3, thereare the hierarchical switches SW whose number is the same as the localbit lines LBL. Although, in the example of FIG. 3, two lines for aswitch control signal SWC(0) are arranged in parallel in the sub-matSM(0) and two lines for a switch control signal SWC(m) are arranged inparallel in the sub-mat SM(m), it is possible to employ a configurationin which one line for the switch control signal SW is arranged in eachsub-mat SM. Further, the hierarchical switches SW may be arranged at thecenter of the local bit lines LBL. Furthermore, a plurality ofhierarchical switches SW may be arranged on each local bit line LBL.

FIG. 4 shows a circuit configuration example of the sense amplifier SAin the sense amplifier array SAA of FIG. 3. The sense amplifier SA shownin FIG. 4 is connected to one global bit line GBL(R) in the memory mat Mon the right and to one global bit line GBL(L) in the memory mat M onthe left, and a pair of the global bit lines GBL(L) and GBL(R) form acomplementary pair. The sense amplifier SA includes a cross coupledcircuit 30, a precharge/equalize circuit 31, an input/output port 32 anda pair of local input/output lines LIOT and LIOB for the columncircuits.

In the cross coupled circuit 30, a pair of transistors Q10 (NMOS) andQ11 (PMOS) forming one inverter have gates connected to the global bitline GBL(R) and a pair of transistors Q12 (NMOS) and Q13 (PMOS) formingthe other inverter have gates connected to the global bit line GBL(L).Each of the inverters functions as a latch circuit in which inputs andoutputs thereof are cross-coupled to each other. The cross coupledcircuit 30 is a voltage differential amplifier being driven by a pair ofsense amplifier driving lines SAP and SAN (FIG. 2) and latching avoltage difference between the global bit lines GBL(R) and GBL(L) inbinary form.

The precharge/equalize circuit 31 corresponds to the precharge circuitPCC of FIG. 1 and includes three NMOS transistors Q14, Q15 and Q16having gates to which the bit line equalizing signal BLEQ is applied.The NMOS transistors Q14 and Q15 function as a precharge circuit thatprecharges the global bit lines GBL(R) and GBL(L) to the prechargevoltage VBLP as the predetermined voltage when the bit line equalizingsignal BLEQ is at a high level. The NMOS transistor Q16 functions as anequalize circuit that equalizes the pair of global bit lines GBL(R) andGBL(L) when the bit line equalizing signal BLEQ is at the high level.

The input/output port 32 is a control circuit for the column circuits,which includes a pair of transistors Q17 and Q18 (NMOS) controllingelectrical connections between the global bit lines GBL(L) and GBL(R)and the local input/output lines LIOT and LIOB in response to apotential of a column select line YS connected to gates thereof. Thecolumn select line YS transmits a signal generated from the externallyreceived address signal ADD via a column address latch and a columndecoder. When the column select line YS is set to a high level, theglobal bit line GBL(R) is connected to the local input/output line LIOTthrough the transistor Q17, and the global bit line GBL(L) is connectedto the local input/output line LIOB through the transistor Q18.

As shown in FIGS. 3 and 4, each global bit line GBL is precharged to theprecharge voltage VBLP by the precharge/equalize circuit 31 in the senseamplifier SA. However, a different precharge circuit is not providedspecifically for precharging each local bit line LBL. The embodimentemploys a configuration for precharging the local bit line LBL from theglobal bit line GBL through the hierarchical switch SW, and a specificcontrol will be described in detail later. In this manner, by utilizingthe precharge/equalize circuit 31 for the global bit lines GBL withoutproviding precharge circuits for the local bit lines LBL, it is possibleto reduce an area of the array region 10 since the precharge circuitsfor the local bit lines LBL whose number is larger than the global bitlines GBL need not to be provided.

Next, an operation of the DRAM of the embodiment will be described withreference to FIGS. 5 to 7. FIGS. 5 to 7 shows three types of operationwaveforms in a read operation in accordance with states of the rowaddress RADT and the redundancy determination signal RDS of FIG. 2. Forexample, a high level of the row address RADT, the redundancydetermination signal RDS, and the sense amplifier driving lines SAP andSAN is a power supply voltage VDD while a low level thereof is a groundpotential VSS, in the operation waveforms of FIGS. 5 to 7. For example,a high level of the bit line equalizing signal BLEQ is a positivevoltage VPP (VPP>VDD) while a low level thereof is the ground potentialVSS. For example, a high level of the switch control signals SWC and thesub-word line SWL to be accessed is the positive voltage VPP while a lowlevel thereof is a negative voltage VKK (VKK<VSS). For example, a highlevel of the global bit lines GBL and the local bit lines LBL is a powersupply voltage VDL while a low level thereof is a ground potentialVSSSA, and an intermediate voltage between the power supply voltage VDLand the ground potential VSSSA is the precharge voltage VBLP.

FIG. 5 shows operation waveforms when the normal sub-mat SM(0) of thememory mat M of FIG. 3 is selected as an access target by the rowaddress RADT and the redundancy determination signal RDS indicates amishit state (non-redundancy). The DRAM is in a standby state at anearly point of FIG. 5 so that the bit line equalizing signal BLEQ is atthe high level. Therefore, the global bit line GBL has been prechargedto the precharge voltage VBLP by the precharge/equalize circuit 31 inthe sense amplifier SA. The switch control signals SWC(0) to SWC(m−1)for the respective normal sub-mats SM(0) to SM(m−1) are maintained atthe low level as an inactive state. The respective local bit lines LBLin the normal sub-mats SM(0) to SM(m−1) have been disconnected from theglobal bit line GBL. Thus, the local bit lines LBL in the normalsub-mats SM(0) to SM(m−1) are in a floating state. In addition, the twolines for the switch control signal SWC(0) in the normal sub-mat SM(0)of FIG. 3 are always controlled in the same way as each other, and thesame may go for other sub-mats SM. In the standby state, the local bitline LBL to be accessed is in the floating state, which is maintained,for example, at the low level (the ground potential VSSSA). Howeversince the sub-word line SWL to be accessed is at the negative voltageVKK as a non-selected state, data of a memory cell MC to be accessed isnot destroyed.

On the other hand, as to the redundant sub-mat SM(m) in the standbystate, the switch control signal SWC(m) for the redundant sub-mat SM(m)has been activated to the high level. At this point, since the globalbit line GBL has been precharged to the precharge voltage VBLP, thelocal bit line LBL of the redundant sub-mat SM(m) continues to beprecharged to the precharge voltage VBLP from the global bit line GBLthrough the corresponding hierarchical switch SW.

Subsequently, an active command ACT is issued, and the row address RADTspecifying the access target is received at the same time. Thereafter,the switch control signal SWC(0) for the normal sub-mat SM(0) to beaccessed is activated to the high level at a time t0. As a result, theprecharge voltage VBLP at which the global bit line GBL is maintained issupplied to the local bit line LBL of the normal sub-mat SM(0) throughthe hierarchical switch SW. Since other normal sub-mats SM(1) to SM(m−1)are not to be accessed, the corresponding local bit lines LBL are in afloating state.

Next, the redundancy determination signal RDS corresponding to the rowaddress RADT is activated by the redundancy determination circuit 12 ata time t1. Here, the time t1 is equal to a time point at which aredundancy determination time Tr is elapsed from the issuing of theactive command ACT. In the example of FIG. 5, the row address RADT doesnot match the defective address, and the redundancy determination signalRDS is maintained at the low level as the mishit state (non-redundancy).

Thereafter, the bit line equalizing signal BLEQ is set to the low leveldue to the activation of the redundancy determination signal RDS at atime t2. Thereby, the precharge/equalize circuit 31 of the senseamplifier SA is inactivated, and the precharge operation of the globalbit line GBL is cancelled. At the same time, the switch control signalSWC(m) of the redundant sub-mat SM(m) is inactivated to the low level bythe redundancy determination signal RDS so that the local bit line LBLof the redundant sub-mat SM(m) is disconnected from the global bit lineGBL. At this time point, the precharge operation of the local bit lineLBL of the redundant sub-mat SM(m) is cancelled so as to be brought intoa floating state. Since the sub-word line SWL in the redundant sub-matSM(m) is maintained at the negative voltage VKK as a non-selected state,data of the memory cell MC of the redundant sub-mat SM(m) is notdestroyed. In addition, setting the bit line equalizing signal BLEQ tothe low level and setting the switch control signal SWC(m) to the lowlevel are preferably completed before a later-described transition ofthe sub-word line SWL. Although these signals transition simultaneouslyin FIG. 5, the bit line equalizing signal BLEQ may transition, forexample, after the switch control signal SWC(m) transitions.

Next, the sub-word line SWL to be accessed in the normal sub-mat SM(0)is driven to the positive voltage VPP at a time t3. Thereby, data storedin the memory cell MC to be accessed is read out to the local bit lineLBL, a potential of the local bit line LBL rises to a predeterminedlevel, and a potential of the global bit line GBL rises in the samemanner through the corresponding hierarchical switch SW. Thereafter, thesense amplifier driving lines SAP and SAN are set to low and high levelsrespectively at a time t4, thereby activating the sense amplifier SA. Asa result of an amplifying operation of the sense amplifier SA, if thedata of the memory cell MC is “1”, for example, both the potentials ofthe local bit line LBL and the global bit line GBL to be accessed riseto the power supply voltage VDL, and a potential of a complementaryglobal bit line GBL that serves as a reference drops to the groundpotential VSSSA.

Next, the sub-word line SWL to be accessed is returned to the negativevoltage VKK at a time t5.

Subsequently, the sense amplifier driving lines SAP and SAN are returnedto high and low levels that are potentials in the standby staterespectively so that the sense amplifier SA is inactivated.

Next, the bit line equalizing signal BLEQ is set to the high level at atime t7. Thereby, since the precharge/equalize circuit 31 of the senseamplifier SA is activated, the global bit line GBL is precharged to theprecharge voltage VBLP again. At this point, since the switch controlsignal SWC(0) of the normal sub-mat SM(0) is at the high level, thelocal bit line LBL is also precharged to the precharge voltage VBLPthrough the global bit line GBL and the hierarchical switch SW.

Thereafter, the switch control signal SWC(0) of the normal sub-mat SM(0)is inactivated to the low level at a time t8, and the local bit line LBLof the normal sub-mat SM(0) is disconnected from the global bit lineGBL. At the same time, the switch control signal SWC(m) of the redundantsub-mat SM(m) is activated to the high level, the local bit line LBL ofthe redundant sub-mat SM(m) is connected to the global bit line GBL soas to return to the initial state (the precharge voltage VBLP). Thereby,an active period based on the active command ACT is finished so as toreturn to the standby state. In addition, the time t7 and the time t8may match each other. If they match each other, when accessing data “0”,for example, through the local bit line LBL as the access target, thelocal bit line LBL maintained at the low level (the ground potentialVSSSA) is brought into a floating state. That is, transition timings ofthe switch control signals SWC(0) to SWC(m) may be freely determinedrespectively within a period after the time t5 at which the sub-wordline SWL is brought into the inactive state or after the time t6 atwhich the sense amplifier SA is brought into the inactive state.

Next, FIG. 6 shows operation waveforms when the normal sub-mat SM(0) ofthe memory mat M of FIG. 3 is selected as the access target by the rowaddress RADT and the redundancy determination signal RDS indicates a hitstate (redundancy). Most of the operation waveforms shown in FIG. 6 arethe same as those in FIG. 5, and thus different points from FIG. 5 willbe mainly described below.

Since FIG. 6 shows potentials of the global bit line GBL and the localbit line LBL of the redundant sub-mat SM(m), the local bit line LBL isalso maintained at the precharge voltage VBLP in the early point inaddition to the global bit line GBL, as different from FIG. 5. This isbecause that the switch control signal SWC(m) of the redundant sub-matSM(m) that has been activated to the high level allows the correspondinghierarchical switch SW to be in a connected state in the standby state.Thereafter, when the redundancy determination signal RDS is activated atthe time t2 after the same operation as in FIG. 5, the row address RADTmatches the defective address and therefore the redundancy determinationsignal RDS changes to the high level as the hit state.

Thereafter, the bit line equalizing signal BLEQ changes at the time t2in the same manner as in FIG. 5 due to the redundancy determinationsignal RDS indicating the hit state. However, the switch control signalsSWC(0) and SWC(m) change differently from those of FIG. 5. That is, theswitch control signal SWC(0) of the normal sub-mat SM(0) is inactivatedto the low level again, and the switch control signal SWC(m) of theredundant sub-mat SM(m) is maintained at the high level as an activestate. As a result, the local bit line LBL of the normal sub-mat SM(0)is disconnected from the global bit line GBL, and the local bit line LBLof the redundant sub-mat SM(m) is connected to the global bit line GBL.

Next, the redundant sub-word line SWLR of the redundant sub-mat SM(m) isdriven to the positive voltage VPP at the time t3, instead of drivingthe sub-word line SWL of FIG. 5. Thereby, data stored in a redundantmemory cell RC of the redundant sub-mat SM(m) is read out to thecorresponding local bit line LBL, a potential of the local bit line LBLrises to the predetermined level, and a potential of the global bit lineGBL also rises in the same manner through the hierarchical switch SW. Asubsequent amplifying operation is performed in the same manner as inFIG. 5. In addition, the levels of the switch control signals SWC(0) andSWC(m) are maintained after the time t8, as different from FIG. 5,thereby shifting to the standby state.

Next, FIG. 7 shows operation waveforms when the normal memory cell MCincluded in the redundant sub-mat SM(m) of the memory mat M of FIG. 3 isselected as the access target by the row address RADT in which both themishit state (non-redundancy) and the hit state (redundancy) areindicated. Most of the operation waveforms shown in FIG. 7 are the sameas those in FIG. 5 or 6, and thus different points from FIG. 5 or 6 willbe mainly described below. In addition, FIG. 7 shows potentials of theglobal bit line GBL and the local bit line LBL similarly as in FIG. 6.

In FIG. 7, since the redundant sub-mat SM(m) is the access targetspecified by the row address RADT, the switch control signal SWC(0) ofthe normal sub-mat SM(0) is always maintained at the low level as aninactive state. The same goes for other normal sub-mat SM(1) to SM(m−1).Meanwhile, regarding an active state of the redundancy determinationsignal RDS of the redundancy determination circuit 12, two types ofstates of the mishit state (low level) and the hit state (high level)are shown overlapping each other at the time t1.

When the redundancy determination signal RDS indicates the mishit state,the sub-word line SWL of the redundant sub-mat (m) is driven at the timet3, and the same operation as in FIG. 5 is performed. On the other hand,when the redundancy determination signal RDS indicates the hit state,the redundant sub-word line SWLR of the redundant sub-mat (m) is drivenat the time t3, and the same operation as in FIG. 6 is performed. Otheroperations are performed in the same manner as in FIG. 5 or 6, sodescription thereof will be omitted. In addition, the switch controlsignals SWC(0) and SWC(m) maintain their states in FIG. 7, therebyshifting to the standby state.

As described above, by employing the configuration and control of theembodiment, it is possible to reduce a circuit scale of the array region10 and to prevent a decrease in access speed in the active operation.That is, the precharge/equalize circuit 31 provided in the senseamplifier SA is utilized not only in a precharge operation of the globalbit line GBL but also in a precharge operation of the local bit line LBLthrough the hierarchical switch SW. In comparison with a configurationin which there are provided precharge circuits for respective local bitlines LBL corresponding to one global bit line GBL (the number of localbit lines LBL is larger than the number of global bit lines GBL), it ispossible to remarkably reduce the circuit scale. Further, in theprecharge operation (in the standby state), instead of turning on thehierarchical switches SW of all the sub-mats SM, only the hierarchicalswitches SW of the redundant sub-mat SM(m) are turned on, therebysuppressing consumption current. Further, after starting the activeoperation, only the hierarchical switches SW of the sub-mat SM to beaccessed are additionally turned on in addition to the hierarchicalswitches SW of the redundant sub-mat SM(m), thereby suppressing theconsumption current. Further, after starting the active operation, thehierarchical switches SW of the sub-mat SM to be accessed are turned onwithout waiting for the determination result of the redundancydetermination circuit 12, it is possible to avoid a delay correspondingto the redundancy determination time, thereby improving the accessspeed.

Next, a case in which the present invention is applied to a dataprocessing system comprising a semiconductor device will be described.FIG. 8 shows a configuration example of the data processing systemcomprising a semiconductor device 100 having the configuration describedin the embodiments and a controller 200 controlling operations of thesemiconductor device 100.

The semiconductor device 100 is provided with a memory cell array 101, aback-end interface 102 and a front-end interface 103. The array region10 of the embodiments is arranged in the memory cell array 101. Theback-end interface 102 includes peripheral circuits of the array region10. The front-end interface 103 has a function to communicate with thecontroller 200 through a command bus and an I/O bus. Although FIG. 8shows only one semiconductor device 100, a plurality of semiconductordevices 100 may be provided in the system.

The controller 200 is provided with a command issuing circuit 201 and adata processing circuit 202, and controls operations of the system as awhole and the operation of the semiconductor device 100. The controller200 is connected with the command bus and the I/O bus, and additionallyhas an interface for external connection. The command issuing circuit201 sends commands to the semiconductor device 100 through the commandbus. The data processing circuit 202 sends and receives data to and fromthe semiconductor device 100 through the I/O bus and performs processesrequired for the controlling. In addition, the semiconductor device 100of the embodiments may be included in the controller 200 in FIG. 8.

The data processing system of FIG. 8 is, for example, a systemimplemented in electronics devices such as personal computers,communication electronics devices, mobile electronics devices and otherindustrial/consumer electronics devices.

The invention described in the embodiments can be widely applied tosemiconductor devices having volatile or nonvolatile memory cells.Further, various circuit configurations can be employed in circuitsincluded in the semiconductor device of the invention without beinglimited to the circuit configurations disclosed in the embodiments.

The invention can be applied to various semiconductor devices such asCPU (Central Processing Unit), MCU (Micro Control Unit), DSP (DigitalSignal Processor), ASIC (Application Specific Integrated Circuit), andASSP (Application Specific Standard Product) and the like. Further, theinvention can be applied to various devices such as SOC (System onChip), MCP (Multi Chip Package) and POP (Package on Package) and thelike.

Further, transistors used in the embodiments are field-effecttransistors (FETs) including various transistors such as not only MOS(Metal Oxide Semiconductor) transistors but also MIS (Metal-InsulatorSemiconductor) transistors, TFT (Thin Film Transistor) and the like.Further, the device of the embodiments may include bipolar transistors.Furthermore, an N-channel type transistor (NMOS transistors) is atypical example of a first conductive type transistor, and a P-channeltype transistor (PMOS transistor) is a typical example of a secondconductive type transistor. Note that, in the embodiments, if the firstconductive type transistor is replaced with the second conductive typetransistor, the potential relation of control signals needs to bereversed in level.

The invention can be applied to devices based on various combinations orselections of the disclosure of the embodiments. That is, the inventioncovers various modifications which those skilled in the art can carryout in accordance with all disclosures including claims and technicalideas.

1. A method for operating a semiconductor device, the method comprising:inactivating a first switch that electrically connects the global bitline and a first local bit line corresponding to normal memory cells,and activating a second switch that electrically connects the global bitline and a second local bit line corresponding to redundant memory cellsusable for replacing normal memory cells; precharging a global bit lineto a predetermined voltage; activating the first switch to connect thefirst local bit line to the global bit line; determining whether anormal memory cell to be accessed is to be replaced with a correspondingredundant memory cell; inactivating the first switch when thedetermination indicates that a replacement of the normal memory cell isperformed and accessing the redundant memory cell; and maintaining thefirst switch in the active state, inactivating the second switch thathas been active when the replacement is not performed, and accessing thenormal memory cell.
 2. The method according to claim 1, furthercomprising maintaining the second switch in the active state while thedetermination is made.
 3. The method according to claim 2, furthercomprising maintaining the second switch in the active state when thereplacement is performed.
 4. The method according to claim 1, whereinthe first switch is activated during a period in which the determinationis being made as to whether the normal memory cell to be accessed is tobe replaced with the corresponding redundant memory cell.
 5. The methodaccording to claim 4, wherein by activating the first switch, the firstlocal bit line is precharged to the predetermined voltage by the timethe determination is made.
 6. The method according to claim 5, whereinthe precharging of the first local bit line occurs in parallel withmaking the determination.
 7. The method according to claim 1, whereinthe determination is made by comparing a row address corresponding tothe normal memory cell to be accessed to a defective address using aredundancy determination circuit.
 8. The method according to claim 1,wherein activating the second switch precharges the second local bitline to the predetermined voltage.
 9. The method according to claim 1,further comprising: when accessing other normal memory cellscorresponding to the second local bit line, maintaining the first switchin an inactive state and maintaining the second switch in an activestate regardless of whether the determination has been made; andaccessing the other normal memory cells or the redundant memory cellsinstead of accessing the normal memory cells.
 10. The method accordingto claim 1, further comprising: activating a word line corresponding tothe normal memory cells if the replacement is not performed; andactivating a redundant word line corresponding to the redundant memorycell if the replacement is performed.
 11. A method for operating asemiconductor device having a memory array comprising: holding a firstlocal bit line corresponding to normal memory cells of the memory arrayin a floating state by deactivating a first hierarchical switch betweenthe first local bit line and the global bit line; precharging a globalbit line to a predetermined voltage; precharging a second local bit linecorresponding redundant memory cells of the memory array to thepredetermined voltage by activating a second hierarchical switch betweenthe second local bit line and the global bit line; in response toreceiving a request to access a normal memory cell, determining whetherthe normal memory cell is to be replaced with a redundant memory cellwhile concurrently precharging the first local bit line to thepredetermined voltage by activating the first hierarchical switch;accessing the normal memory cell if a replacement is not made; andaccessing the replacement memory cell if the replacement is made. 12.The method of claim 11, comprising, after precharging the first localbit line by activating the first hierarchical switch, deactivating thesecond hierarchical switch and disconnecting the second local bit linefrom the global bit line if it is determined that the replacement is notto be made.
 13. The method of claim 11, comprising, after prechargingthe first local bit line by activating the first hierarchical switch,deactivating the first hierarchical switch if it is determined that thereplacement is to be made.
 14. The method of claim 11, wherein the firstlocal bit line and the second local bit line do not includecorresponding precharging circuits separate from the first and secondhierarchical switches.
 15. The method of claim 11, wherein thedetermination of whether a replacement is to be made is indicated by asignal generated by a redundancy determination circuit that compares anaddress in the received request to one or more defective addresses. 16.The method of claim 15, comprising outputting the signal to a rowdecoder, a memory mat control unit, and a switch control unit of thesemiconductor device.